Tools / Material
Tools / Material
Items 1 - 2 of 2
- Universal 2k epoxy resin adhesive, room temperature curing
- Preparation: Surfaces to be bonded should be dry, free of dust, grease and other contaminants
- Processing: Cut open the sachet, empty the contents completely and mix both components intensively for approx. 30 s
- Working time 4 minutes. Curing Manual strength 8 minutes, functional strength 2 hours, final strength 24 hours.
- ✔ Conveniently packaged in packs of 2.
- Composition: 3.5 % silver, 0.7 % copper, 93.8 % tin; flux content: 2 %; melting point 217° C
- Significantly improved electrical conductivity due to silver content (3.5 %)
- No cleaning of the solder joints necessary after soldering
- "No-clean solution" with continuous flux cores
- halogen-free and low smoke emission.
Items 1 - 2 of 2