Tools / Material
- Universal 2k epoxy resin adhesive, room temperature curing
- Preparation: Surfaces to be bonded should be dry, free of dust, grease and other contaminants
- Processing: Cut open the sachet, empty the contents completely and mix both components intensively for approx. 30 s
- Working time 4 minutes. Curing Manual strength 8 minutes, functional strength 2 hours, final strength 24 hours.
- ? Conveniently packaged in packs of 2.
- 8 pieces
- .
- 62 x 12 mm each
- Sizes specially adapted for modding
- From 2mm cable (AWG22) up to 510, push button, mosfet
- In the colors red and black
- Shrink ratio 2:1