Tools / Material
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- Composition: 3.5 % silver, 0.7 % copper, 93.8 % tin; flux content: 2 %; melting point 217° C
- Significantly improved electrical conductivity due to silver content (3.5 %)
- No cleaning of the solder joints necessary after soldering
- "No-clean solution" with continuous flux cores
- halogen-free and low smoke emission.
Items 1 - 2 of 2