Goobay
- Composition: 3.5 % silver, 0.7 % copper, 93.8 % tin; flux content: 2 %; melting point 217° C
- significantly improved electrical conductivity due to silver content (3.5 %)
- no cleaning of solder joints after soldering necessary
- "No-clean solution" with continuous flux cores
- halogen-free and low smoke emission.