Evolv DNA 60 Board with Small Display

ATTENTION: Evolv now sells the DNA 60 chipset without the USB charging board. The charging board can be purchased separately or here in a bundle.

Display: Ohne Display und USB Lade Board43,25 €

Display Big (128 x 32 OLED)51,93 €

Mit Display Big (128x32) UND Lade Board (USB 1A)59,89 €

Display Small 96 x 16 OLED51,93 €

Mit Display Small (96x16) UND Lade Board (USB 1A)59,89 €

51,93 €

incl. 19% VAT , plus

When buying different article variants together, the scale prices also apply.

This item has variations. Please select the requested variation.

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Order now - in a bundle with discount

2 x Delo Duopox rapid 01, 2-component universal high-performance epoxy adhesive, 3g +8,71 € +8,28 €

Universal 2k epoxy resin adhesive, room temperature curing
Preparation: Surfaces to be bonded should be dry, free of dust, grease and other contaminants
Processing: Cut open the sachet, empty the contents completely and mix both components intensively for approx. 30 s
Working time 4 minutes. Curing Manual strength 8 minutes, functional strength 2 hours, final strength 24 hours.
✔ Conveniently packaged in packs of 2.

Item details

Quantity: 1

V&M button for Evolv DNA boards, golden yellow (brass) +6,93 € +6,50 €

Four push buttons for Evolv DNA boards. One large power button (Ø 8mm) and three small control buttons (Ø 4mm)
Length optimized for boxes with a wall thickness of 2mm
Three different colours/materials: silver (stainless steel), black (anodized aluminium), golden yellow (brass)

Item details

Quantity: 1

V&M button for Evolv DNA boards, color: silver (stainless steel) +6,65 € +6,22 €

Four push buttons for Evolv DNA boards. One large power button (Ø 8mm) and three small control buttons (Ø 4mm)
Length optimized for boxes with a wall thickness of 2mm
Three different colours/materials: silver (stainless steel), black (anodized aluminium), golden yellow (brass)

Item details

Quantity: 1

Goobay solder lead-free, with flux, 3.5% silver, ø 1.0 mm, 12.5 g +4,99 € +4,44 €

Composition: 3.5 % silver, 0.7 % copper, 93.8 % tin; flux content: 2 %; melting point 217° C
Significantly improved electrical conductivity due to silver content (3.5 %)
No cleaning of the solder joints necessary after soldering
"No-clean solution" with continuous flux cores
halogen-free and low smoke emission.

Item details

Quantity: 1